Apple is reportedly adopting technologies that will allow it to give its upcoming iPhone handset an an ultra-thin profile.
Analyst Ming-Chi Kuo of KGI securities gave credence to earlier rumours by predictin Apple will make hardware changes which will allow the company reduce the thickness of its handset to less than 8mm.
Kuo told blog Apple Insider that industry sources indicated Apple would integrate the iPhone's touch sensors and controls directly into the handset's TFT LCD touchscreen display.
The move would allow Apple to take away the sensor layer used in previous models and allow the company to reduce the handset's thickness.
The report also suggests that the company has improved its manufacturing processes in order to reduce the number of components needed when assembling the iPhone's display hardware.
The report comes just days after Apple was rumoured to be developing a new material for use on the back panel of the upcoming iPhone. That report suggested the company was looking to adopt a 'liquid metal' alloy which would further lighten and slim down the iPhone.
Apple is expected to introduce its new iPhone later this year. While early reports hinted at a spring unveiling, later reports have indicated that the handset may not debut until autumn.
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