IBM is to invest $700 million in an advanced chip development facility in New York state, and will also spend $10 million renovating its former headquarters building in Armonk, New York. This will then house the IBM Credit unit. The chip unit will focus primarily on next generation manufacturing techniques using 12-inch instead of eight-inch silicon wafers. The two projects will create 500 new jobs.
Geoengineering on the sea floor near glaciers would form a new ice shelf to prevent melting
Alterations in capillary blood flow can be caused by body position change
Curiosity rover is in 'normal mode' but not transmitting scientific data back to base
NatWest outage comes a day after Barclays' IT systems shut out customers and staff