Fujitsu has unveiled a plan to build a semiconductor fab that will process 300mm wafers using the latest 65nm production process.
The new fab will be Fujitsu's second 300mm wafer production site and will be located in Mie, Japan.
On completion in April 2007, the £595m facility is expected to have a production capacity of 10,000 wafers a month. Depending on market demand, capacity can be expanded to 25,000 wafers, the company said.
Fujitsu is an IT and communications provider with $44.5bn in revenues over its past fiscal year. The company produces flash memory chips through its Spanium joint venture with AMD.
Most semiconductor manufacturers currently use a 90nm production process. Intel already operates a more efficient 65nm production line, and has unveiled plans to construct 45nm facilities in Oregon and Israel.
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