Memory module manufacturer and distributor Dane-Elec said today that it had succeeded in a technique for creating three dimensional memory modules.
The company said that the technique was adapted from component miniaturisation and high density technologies, allowing it to stack memory chips inside a cubic package using BGA surface mount technology.
The advantages of the technique is that it gives higher access speeds because of reduced connection length and also gives benefits in electrical, mechanical and thermal performance.
Dane-Elec said it will be able to build 1Gbyte on a single motherboard connector.
New light-guiding nanoscale device can control and monitor a nanoparticle trapped in a laser beam with high sensitivity
Optical traps are scientific instruments in which a focused laser beam is used to exert an attractive or repulsive force on a microscopic object to hold it in place
Scientists estimate that the exoplanet has already lost up to 35 per cent of its mass over its lifetime
The observations were made using the Atacama Array in the Chilean desert
J1043+2408 was observed for more than 10 years, and its radio light curve exhibited a periodic signal repeating in about 563 days