NEC unveiled what it calls a system-in-package (SiP) technology capable of stacking logic and gigabit-class memory in a single package to enable high-speed, high-definition image processing in portable devices.
The new SiP technology, known as SMAFTI (SMArt connection with Feed-Through Interposer), features a three-dimensional chip connection that can support transmissions up to 100Gbps. SMAFTI technology used in portable equipment can achieve resolutions comparable to those achieved in high-definition television.
The multichip assembly process used in the construction of the technology is an enhancement of existing wafer-based manufacturing processes that are typically used for SOC manufacturing. Memory chips are first mounted onto silicon wafers using wiring based on superconnect technology. Then the chips and wiring layer are molded by resin and the silicon wafer is removed.
Superconnect technology is used in chip fabrication and has a copper signal trace 15 microns wide and a polyimide layer seven microns thick – half that of a conventional substrate. The 15-microns-thick FTI, which is based on superconnect technology, makes it possible to convert a chip's wiring pitch to 50 microns and to fan out the pitch connection of an outer ball grid array to 500 microns. As a result, the routing of signals from a logic chip with a 50-micron pitch and memory connection points to universal substrate terminals can be simplified.
"The strong demand for digital video television, digital video gaming and other digital video capabilities in portable consumer devices is driving the need for high-speed image processing that realises crystal-clear resolutions," said Takaaki Kuwata, general manager, Advanced Device Development Division, NEC. "System-on-chip (SOC) technologies present a disadvantage in terms of development cost and memory capacity, while conventional SiP products have larger package sizes due to thicker interposers, and have limitations in signal transfer speed, wire-bonding interconnections, and side-by-side chip placement. The new SMAFTI technology successfully resolves these issues and enables engineers to effectively design and manufacture high-performance systems for mobile electronic devices."
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