Chip maker AMD has taken the wraps off two new additions to its processor range designed for the ASB1 BGA embedded client platform.
The new AMD Turion Neo X2 processor Model L625 and the Athlon Neo X2 processor Model L325 are dual-core, 18W CPUs and included in an embedded-friendly ball grid array (BGA) package designed for rugged environments.
The new system is aimed at traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage.
"We are committed to helping simplify the development cycle for our embedded customers with a platform that readily addresses the shifting needs of their markets," said Buddy Broeker, director of the Embedded Computing Solutions Division at AMD.
"Systems such as digital signage, point of sale and thin clients require PC-class performance and a rich graphics experience. Our ASB1 BGA platform is a ready-to-go, one-stop solution for these markets and at the same time offers the flexibility of multiple CPU and chipset choices."
The company recommends combining the BGA with either the AMD 780E or M690E chipset for included graphics and connectivity.
"The rapid adoption of x86 processors in embedded designs, which is a trend that AMD helped spur in the high-end space, has largely been driven by the need to simplify designs and get them on the market more quickly," said Eric Heikkila, director of Embedded Hardware and systems analyst for VDC Research Group.
"From the hardware perspective, AMD's comprehensive platform approach offers mainstream performance, very low power consumption, and takes a lot of the guesswork out of the development process."
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