Intel claims to have come up with a breakthrough in chip manufacturing technology that could see processors hitting the 20Ghz mark by 2006.
The technology will allow a chip to feature over one billion transistors, a far cry from the 42 million possible on today's Pentium 4 design.
Dubbed 'Bumpless Build-Up Layer' (BBUL), the technology allows transistors to be attached to a chip whilst avoiding solder bumps.
Solder bumps limit the number of transistors because they cannot touch each other. If they did, the chip would short circuit.
Bumpless packaging will allow not only for faster and smaller processors, but will also go some way to reducing electrical power consumption and heat production, making the chip much more efficient.
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