Samsung Electronics today unveiled multi-chip package (MCP) technology which will be incorporated into Sony Corporation's PlayStation Portable (PSP) game system and and next generation consumer devices.
According to the electronics giant, the small physical size of its MCP devices will offer consumer manufacturers a higher level of functionality and data storage for multimedia devices such digital cameras and phones.
With a MCP processing rate of 1.3GB per second, the MCP devices supplied for the Sony PSP have a capacity of 64 megabytes and consist of 256 Mb NAND flash memory and high-speed mobile DDR (double-data-rate) DRAM memory.
Camera manufacturers will use a combination of mobile DRAM and NOR flash memory, or mobile DRAM and OneNAND memory, in their digital cameras, Samsung said.
The company added that, as demand for MCP technology grows, it will increase manufacturing efforts of MCPs for mobile phones as well as consumer electronic mobile devices.
Samsung, the first company to develop six-stack and eight-stack MCPs, will begin shipping its MCP devices to Sony and to digital still camera manufacturers this quarter.
14nm Cavium ThunderX2 CPUs deployed in HPE Apollo 70 supercomputer for US National Nuclear Security Administration
MWR's Countercept platform and phishd technologies key to F-Secure acquisition
Brexit labour shortages will lead to higher adoption of robotics
Newbies will be thrown in with the big boys on Sanhok as Kar98 fodder