IBM and partners move to 28nm chip fabrication

IBM's new chip will go up against Intel's Atom

IBM and a number of other technology companies are to collaborate on a new 28nm chip for the mobile market.

The Joint Development Alliance, which includes Chartered Semiconductor, GlobalFoundries, Infineon, Samsung, STMicro and Toshiba, expects to begin production by 2010.

The chip will primarily be used in the mobile and netbook market, and will go up against Intel's 45nm Atom processor.

"Through this collaboration, IBM and its alliance partners are helping to accelerate development of next-generation technology to achieve high-performance, energy-efficient chips at the 28nm process level, maintaining our focus on technology leadership for our clients and partners," said Gary Patton, vice president at IBM's Semiconductor Research and Development Center.

IBM claimed that moving to 28nm technology gives a 40 per cent performance improvement and a more than 20 per cent reduction in power. The new chips will also use high-k metal gate technology which cuts down on power leakage.

"This statement of commitment to 28nm low-power technology by the IBM Joint Development Alliance is an important progression from 32nm high-k metal gate technology," said Jorgen Lantto, chief technology officer at ST-Ericsson.

"Leaders in the mobile industry can utilise 28nm low-power technology to meet the increasingly aggressive demands for performance and improved battery life."