Centrino to support 3G and WiMax

Intel today outlined its communications roadmap at 3GSM in Cannes, demonstrating new technologies for future phones.

Company president Paul Otellini said that by 2006 the Centrino platform would support wireless broadband standard WiMax and 3G mobile at a processor level, and that by 2007 handset chipsets like Manitoba would also do so.

"What we do best is innovate new technologies and integrate them onto silicon over time," he explained.

"One standard around the world is not sufficient. Consumers will demand co-existence on products and services as they roll out."

He also gave clues about the future of the Manitoba chipset, introduced by Intel last year as its first chipset for mobile devices. The chip giant is expected to unveil a second-generation chip by June.

By 2006, Otellini predicted, mobile phones will have the power of a Pentium 3 and support multiple radio standards and 3D graphics. By 2008, he added, he hopes to see almost the entire phone package reduced to three chips small enough to allow for a range of new mobile phone designs.

Other demonstrations included Zoar, a new phone with 802.11, GSM/GPRS and Bluetooth radio built in along with a full-motion video camera, enhanced sound and multi-operating system support.

The reference designs will be released to industry later this year. No details were given on battery life but this will be crucial, as Wi-Fi is more power-hungry than most phone applications.

Also on show was a PDA codenamed Carbanado, boasting full VGA graphics capable of video. Otellini said a major original equipment manufacturer would be producing the PDAs, but declined to give any more details.