Via shrinks chipset for Ultra Mobile PCs

Via's VX7000 chipset should allow for smaller Ultra Mobile PCs

Via Technologies has unveiled what it claims is the world's first chipset designed for Ultra Mobile PCs.

The new VX7000 allows manufacturers to build devices 40 per cent smaller, the company claimed, and works with Via's C7-M processor designed to power small devices.

The first UMPCs were unveiled earlier this year offering PC functionality in a portable form factor. However, after the initial hype, reviewers reported disappointment about the bulky size, poor battery life and limited features.

Via's new chipset integrates North and South bridges onto a single chip, leading to a 42 per cent size reduction.

The VX7000 also features an integrated graphics controller and image enhancement technology for video acceleration, as well as an audio controller and support for six USB2.0 ports, four PCI slots, Sata II and Pata drives.

The chipset is scheduled for availability in volume by the third quarter of this year.